Layers shi matsat dingyang plasma jak

Shi matsat-Layer Vertical Plasma jak ni hpe n-gun n rawng ai sha hpaw shalawm mai ai.MES ladat ni hte barcode scan galaw ai magam bungli ni, upper-computer hpe hkang lu ai, lusha shadu ai ladat hpe tam lu ai, hte galaw sa wa ai lam hpe tup hkrak hkan tam lu ai. Production data hpe aten dep yu reng nna ka matsing da lu ai majaw, customers ni hpe grau kaja ai galaw shapraw ai lam hpe lu la na matu hte quality hpe grai sadi maja let hkang lu na matu karum ya lu ai. Dai system hta mung .tengman ai- aten hpe yu reng ai, shi hkrai shi hkrit tsang ai magam bungli ni, hte lusha shadu ai ladat hte ahkang jaw ai lam ni hpe hparan ai, batch law law hte process law law lapran lawan ai hku galai shai lu ai sha n-ga, shim lum ai hte ngang grin ai hku bungli galaw lu ai. Ndai hpaji rawng ai atsam ni gaw, -volume law ai galaw shapraw ai makau grup yin ni hta, bungli galaw ai lam hte n-gun atsam hpe grai shatsaw ya lu ai.

Ndai jak hpe madung hku nna 2019 ning a matu galaw da ai re.HDI (Tsaw-N-gun ja ai shada da matut mahkai ai lam) n-gun n rawng ai ladat ni. Plasma tsi gaw, jak (sh) laser hte htu ngut ai hpang ngam nga ai resin n-gun ni hpe atsawm sha yeng seng kau ya nna, hka htung bunghku ni hpe san seng ai hte n-gun n rawng hkra galaw ya lu ai. Ndai lam gaw hpang na metalization a kam hpa mai ai lam hte matut mahkai ai atsam hpe grai jat ya ai. Grau nna, hpaji rawng ai jak ni, 5G matut mahkai lam, semiconductor packaging substrates zawn re ai hpaga lam ni hta, grai hkrak ai hte -density kaba ai matut mahkai lam ni ra ai, rawt jat galu kaba wa ai PCB galaw shapraw ai lam a matu grai ahkyak nga ai.

Katsi ai ladat: Utilizes adual-hka lam hkrang shapraw ai lam, vacuum chamber hte dry vacuum pump lahkawng yan a matu shanglawt ai hku katsi shangun ai. Ndai lam gaw, aten galu bungli galaw ai aten hta pyi, ngang grin ai processing performance hpe galaw ya lu ai, dai sha n-ga, ahkyak ai arung arai ni a asak hpe mung galu shangun lu ai.

Shi matsat-layer dingyang plasma jak gawkaba ai-scale galaw lu ai atsam hte tsaw ai automation, dai gaw rawt jat galu kaba wa ai PCB hte HDI galaw shapraw ai lam a matu kaja dik ai hparan ladat langai byin tai wa ai. Dai gaw ngang grin ai, n galai shai ai desmear galaw ai lam hpe madi shadaw ya ai, MES hte barcode hpe hpawng de ai gaw, galaw shapraw ai lam hpe tup hkrak hkan tam lu ai hte, galaw sa wa ai lam hpe hkang lu ai atsam hpe jat ya lu ai. -madang tsaw ai core components ni hte kaja dik htum katsi ai ladat hte, jak gaw .ngang grin ai hku bungli galaw lu ai, n-gun atsam hpe jailang lu ai, grup yin hpe makawp maga lu ai, gram lajang na matu loi ai. PCB galaw shapraw ai ni a matu, n-gun kaba ai, kam hpa mai ai, gat lawk hta shingjawng lu na matu shakut nga ai ni a matu, ndai masa gaw, ya aten hte htawm hpang na ra kadawn ai lam ni hpe hkap la lu na matu ahkyak ai arung arai langai rai nga ai.

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