LED RF plasma jak ni

LCD RF Plasma Equipment hpe liquid crystal display arung arai ni hte dai hte seng ai electronic arung arai ni hpe npu kaw na gram lajang na matu laksan galaw da ai re. Dai jak a shadawn shadang yawng gaw 900W × 1750H × 1200D (mm) rai nga ai. Shi a vacuum chamber hpe ngang grin ai n-gang hte galaw da ai rai nna, 450 × 300 × 450 mm kaba nna, batch langai hta sha, shinggrup da ai tray 6 du hkra hpe shinggyin la lu ai. Ndai hkrang masa gaw, pilot-scale chyam dinglik ai lam ni hte, n-gun kaba ai hpaga lam galaw shapraw ai lam lahkawng yan hpe madi shadaw ya lu ai.

 

Magam bungli masa a matu, ndai jak gaw mungkan ting masat da ai brand ni kaw na lu la ai -quality tsaw ai wan jak ni hpe hpawng de da nna, aten galu-bungli galaw ai lam hpe ngang grin hkra galaw ya lu ai. Ndai system gaw manual hte fully automated mode lahkawng yan hpe jaw ya ai majaw, bungli galaw ai shaloi, n-gun n rawng ai hku galaw lu ai. Operator, engineer, hte advanced user access-madang masum-ahkaw ahkang uphkang masa-hkap la ai gaw shim lum ai hku galaw shapraw ai lam hpe madi shadaw ya nna ahkang n lu ai hku galai shai ai lam ni hpe pat shingdang ya ai. Hpaga lam hpe hkan tam lu na matu, ndai jak hta, shata shagu galaw ai lam a jahpan ni hpe shi hkrai shi ka matsing da nna, backup galaw ai, hpawng de da ai shiga jaw ai ladat hpe lang da ai. User ni gaw n-htum n-wai ai process recipe ni hpe shinggyin la lu nna bai dum wa lu ai majaw, n bung ai arung arai ni hte jai lang ai lam ni a matu shim lum ai hku galai shai lu ai.

Dai core system hkrang gaw, n-gun n rawng ai n-gang pipeline hte bellow ni hpe lang nna, n-gun rawng ai GDQ vacuum valve ni hpe lang nna, n-gun rawng ai nbung hpe hkang lu na matu lang ai. Vacuum shadawn ai lam hpe Pirani ninghkap ai vacuum gauge hte galaw ai majaw, hkrak tup hte ngang grin ai hku hti lu ai. Htingnu kata hpe garan tawn na matu, n-gun ja ai-vacuum gate valve hpe mung bang da ai. Dai hkang zing ai ladat gaw, Mitsubishi PLC hpe jat wa ai module ni hte kam hpa nna, hkrak tup ai hte kam mai ai ladat parameter ni hpe hkang zing ai lam hpe jaw ya ai.

Hpaji masa hku yu yang, ndai jak gaw, nitrogen (N2), argon (Ar), hydrogen (H2), hte oxygen (O2) ni hpe madi shadaw ya ai, nbung lam masum hpe jaw ya ai. Vacuum level hpe 10–50 Pa lapran hta hkang lu ai, pressure galai shai ai lam hpe 5% laman hta tawn da lu ai. Gas lwi ai n-gun hpe 0–200 sccm lapran hta gram lajang mai ai. Katsi ai nitrogen, nbung hpe shinggrup da ai, hte process gas lapran na nbung ni gaw 0.45 MPa (sh) dai hta npu hta shim lum ai hku bungli galaw lu ai. Plasma tsi ladat gaw, anode hte cathode electrode ni hpe galai shai ai hku nna, direct plasma hku nna tsi lajang ai ladat re. Electrode group lahkawng hte mali lapran hpe kalang ta bang mai ai. Electrode langai hpra gaw 380 × 310 mm a akyu rawng ai ntsa lamu ga jarit nga ai, electrode lapran na tsan gang ai lam hpe mung gram lajang mai ai, 2.5 cm daram shadawn shadang nga ai.

Hpaga lam hta jai lang ai hta, ndai jak gaw, encapsulation (molding) galaw ai lam ni garai n galaw shi yang, ntsa lam hpe jasan jaseng na matu grau nna manu dan nga ai. Plasma tsi lajang ai gaw, n san seng ai arung arai ni hpe shapraw kau ya nna, substrate ntsa hpe shamu shamawt shangun ai majaw, matut mahkai shara hte n-gun hpe kaja wa jat ya lu ai. Ndai lam gaw, n-gun dat ai shaloi, delamination (sh) garan ginhka ai lam hpe pat shingdang ya nna, n-gun dat hpe grau kam hpa lu hkra karum ya ai. Shi a ngang kang ai hkrang shapraw ai lam, rawt jat galu kaba wa ai hkang zing ai lam ni, hte hkrak tup galaw sa wa ai lam ni a majaw, ndai ladat gaw n galai shai ai, bai galaw mai ai plasma tsi lajang ai lam a mahtai ni hpe jaw ya lu ai majaw, LCD panel galaw shapraw ai lam hta mung, semiconductor packaging application ni a matu mung, kaja dik ai hparan ladat langai rai nga ai.

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