N-gun n rawng ai RF Plasma jak
Vacuum Inline RF plasma Equipment gaw, grau nna IC substrate lang na matu, laika ka da ai circuit board ntsa ni hpe jasan jaseng na matu hte shamu shamawt na matu galaw shapraw da ai laksan jak langai rai nga ai. Madung hku nna, dry film imaging stage hte post-solder mask coating ngut ai hpang lang ai, dai shara hta, n-gun n-gun hpe jat wa hkra, hpang na bungli ni hta grau kam hpa mai ai lam hpe lu la na matu, ntsa lam hpe atsawm sha hkyen lajang ai lam gaw ahkyak nga ai. Hkamja lam hpe hkang lu ai vacuum chamber kata kaw plasma tsi lajang ai lam hpe galaw ai hku nna, ndai system gaw organic residues hte ntsa na n san seng ai arung arai ni hpe atsawm sha shapraw kau ya lu ai majaw, yawng hkra a matut mahkai ai lam hte product quality hpe grau kaja hkra galaw ya lu ai.
Hpaga arai ni hpe sang lang dan ai
Vacuum Inline RF plasma Equipment gaw, grau nna IC substrate lang na matu, laika ka da ai circuit board ntsa ni hpe jasan jaseng na matu hte shamu shamawt na matu galaw shapraw da ai laksan jak langai rai nga ai. Madung hku nna, dry film imaging stage hte post-solder mask coating ngut ai hpang lang ai, dai shara hta, n-gun n-gun hpe jat wa hkra, hpang na bungli ni hta grau kam hpa mai ai lam hpe lu la na matu, ntsa lam hpe atsawm sha hkyen lajang ai lam gaw ahkyak nga ai. Hkamja lam hpe hkang lu ai vacuum chamber kata kaw plasma tsi lajang ai lam hpe galaw ai hku nna, ndai system gaw organic residues hte ntsa na n san seng ai arung arai ni hpe atsawm sha shapraw kau ya lu ai majaw, yawng hkra a matut mahkai ai lam hte product quality hpe grau kaja hkra galaw ya lu ai.
Ndai jak a laklai ai lam langai gaw, shi a dual-chamber htingnu gawgap ai lam rai nga ai. Chamber shagu hta laksan hku nna vacuum pump hte RF plasma generator ni hpe hpaw da ai majaw, langai hte langai bungli galaw lu ai (sh) galai shai lang lu ai. Ndai lam gaw throughput hpe sharawt ya ai sha n-ga, bungli galaw ai lam hta mung n-gun jaw ya ai. -aten galu ngang grin ai lam hpe makawp maga na matu, ndai system gaw, pump hte plasma source lahkawng yan a matu, bungli galaw ai nbung katsi ai lam hpe n galai shai ai sha, pat da ai-loop cooling module hpe hpawng de da ai. Automation ra ai galaw shapraw ai line ni a matu, lata hte galaw ai lam hpe shayawm kau lu na matu hte upstream hte downstream arung arai ni hte n-gun n rawng ai hku matut mahkai lu na matu, lata la mai ai htaw ai hte jahkrat ai ladat ni hpe jat bang mai ai.
Dai system kata na material flow hpe atsawm sha galaw da ai. Board ni hpe shang ai shara de sa ya nna, robot grippers ni hte ngang ngang jum da ai, dai hpang substrate ni hpe sub-frame langai mi de bang da ai. Elevator platform hte mawdaw gau ai roller ni hte madi shadaw ya ai board ni hpe plasma tsi lajang na matu vacuum chamber de htawt bang ai. Processing ngut ai hpang, dai roller ni nan board ni hpe chamber kaw na shapraw kau nna, dai kaw na grippers ni gaw bai hkap la nna, hpang na stage de ap ya ai. Sub-frame gaw station lapran hta shi hkum shi shingjawng ai majaw, n ra ai aten n htum ai sha, bungli hpe hkrak hkrak galaw lu na re.
Gas jaw ai lam hpe mung langai sha re ai hku galaw na matu kaja dik htum galaw da ai. Reactive gases ni hpe manifold hku nna shawng nnan hka ja nna, ntsa hte lawu hka shang ai shara lahkawng yan kaw nna nta kata de n shang shi yang, plasma hpe ntsa lam ting hta maren mara garan gachyan lu hkra galaw ya ai. Exhaust galaw ai shaloi, nbung hpe lawan ladan shapraw ya lu na matu, n-gun n rawng ai aten hpe shayawm ya lu nna, cycle hpe grau kaja hkra galaw lu na matu, compressed air hpe chamber kata de bang ya ai. Shi a ngang kang ai bungli galaw ai lam, ngang grin ai bungli galaw ai lam, hte automation-jin jin rai sai hkrang shapraw ai lam ni hte, ndai plasma jasan jaseng ai ladat gaw, rawt jat galu kaba wa ai IC substrate galaw shapraw ai lam a matu grai kam hpa mai ai hparan ladat hpe jaw ya nga ai.
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